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IXFR44N50Q Datasheet, PDF (1/2 Pages) IXYS Corporation – HiPerFET Power MOSFETs ISOPLUS247 Q-Class
HiPerFETTM
Power MOSFETs
ISOPLUS247TM, Q-Class
IXFR 44N50Q
IXFR 48N50Q
(Electrically Isolated Backside)
N-Channel Enhancement Mode
Avalanche Rated, Low Qg, High dv/dt
VDSS
500 V
500 V
ID25
34 A
40 A
RDS(on)
120 mΩ
110 mΩ
trr ≤ 250 ns
Symbol
VDSS
V
DGR
VGS
V
GSM
ID25
IDM
IAR
EAR
EAS
dv/dt
PD
TJ
TJM
Tstg
TL
VISOL
Weight
Symbol
VDSS
VGS(th)
IGSS
IDSS
R
DS(on)
Test Conditions
Maximum Ratings
TJ = 25°C to 150°C
TJ = 25°C to 150°C; RGS = 1 MΩ
Continuous
Transient
TC = 25°C
TC = 25°C, Note 1
TC = 25°C
TC = 25°C
TC = 25°C
IS ≤ IDM, di/dt ≤ 100 A/µs, VDD ≤ VDSS
TJ ≤ 150°C, RG = 2 Ω
TC = 25°C
1.6 mm (0.063 in.) from case for 10 s
50/60 Hz, RMS t = 1 min
500
500
±20
±30
44N50Q 34
48N50Q 40
44N50Q 176
48N50Q 192
44N50Q 44
48N50Q 48
60
2.5
5
310
-55 ... +150
150
-55 ... +150
300
2500
5
V
V
V
V
A
A
A
A
A
A
mJ
J
V/ns
W
°C
°C
°C
°C
V~
g
Test Conditions
VGS = 0 V, ID = 250µA
VDS = VGS, ID = 4mA
VGS = ±20 V, VDS = 0
VDS = VDSS
VGS = 0 V
VGS = 10 V, ID = IT
Notes 2, 3
Characteristic Values
(TJ = 25°C, unless otherwise specified)
min. typ. max.
500
2.0
TJ = 125°C
44N50Q
48N50Q
V
4.0 V
±100 nA
100 µA
2 mA
120 mΩ
110 mΩ
ISOPLUS 247TM
E153432
Isolated backside*
G = Gate
S = Source
D = Drain
* Patent pending
Features
l Silicon chip on Direct-Copper-Bond
substrate
- High power dissipation
- Isolated mounting surface
- 2500V electrical isolation
l Low drain to tab capacitance(<30pF)
l IXYS advanced low Qg process
l Rugged polysilicon gate cell structure
l Rated for Unclamped Inductive Load
Switching (UIS)
l Fast intrinsic diode
Applications
l DC-DC converters
l Battery chargers
l Switched-mode and resonant-mode
power supplies
l DC choppers
l AC motor control
Advantages
l Easy assembly
l Space savings
l High power density
© 2002 IXYS All rights reserved
98702B (6/02)