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IXFN230N10_08 Datasheet, PDF (1/5 Pages) IXYS Corporation – Power MOSFET Single Die MOSFET
Power MOSFET
Single Die MOSFET
IXFN230N10
N-Channel Enhancement Mode
Avalanche Rated, High dv/dt, Low trr
Symbol
VDSS
VDGR
VGSS
VGSM
ID25
IL(RMS)
IDM
IA
EAS
dV/dt
Pd
TJ
TJM
Tstg
VISOL
Md
Weight
Test Conditions
TJ = 25°C to 150°C
TJ = 25°C to 150°C, RGS = 1MΩ
Continuous
Transient
TC = 25°C, Chip capability
External lead current limit
TC = 25°C, pulse width limited by TJM
TC = 25°C
TC = 25°C
IS ≤ IDM, VDD ≤ VDSS, TJ ≤ 150°C
TC = 25°C
50/60 Hz, RMS t = 1min
IISOL ≤ 1mA
t = 1s
Mounting torque
Terminal connection torque
Maximum Ratings
100
V
100
V
±20
V
±30
V
230
A
200
A
920
A
100
A
4
J
10
V/ns
700
W
-55 ... +150
150
-55 ... +150
2500
3000
1.5/13
1.3/11.5
30
°C
°C
°C
V~
V~
Nm/lb.in.
Nm/lb.in.
g
Symbol
Test Conditions
(TJ = 25°C, unless otherwise specified)
BVDSS
VGS = 0V, ID = 3mA
VGS(th)
VDS = VGS, ID = 8mA
IGSS
VGS = ±20V, VDS = 0V
IDSS
VDS = VDSS
VGS = 0V
TJ = 125°C
RDS(on)
VGS = 10V, ID = 0.5 • ID25, Note 1
Characteristic Values
Min. Typ. Max.
100
V
2.0
4.0 V
±200 nA
100 μA
2 mA
6.0 mΩ
VDSS = 100V
ID25 = 230A
≤ RDS(on) 6.0mΩ
trr
≤ 250ns
miniBLOC, SOT-227 B
E153432
S
G
S
D
G = Gate
S = Source
D = Drain
Either Source terminal at miniBLOC can be used
as Main or Kelvin Source
Features
• International standard package
• miniBLOC, with Aluminium nitride
isolation
• Low RDS (on) HDMOSTM process
• Rugged polysilicon gate cell structure
• Avalanche rated
• Guaranteed FBSOA
• Low package inductance
• Fast intrinsic Rectifier
Advantages
• Easy to mount
• Space savings
• High power density
Applications
• DC-DC converters
• Battery chargers
• Switched-mode and resonant-mode
power supplies
• DC choppers
• Temperature and lighting controls
© 2008 IXYS Corporation, All rights reserved
DS98548F(12/08)