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IXFL70N60Q2 Datasheet, PDF (1/4 Pages) IXYS Corporation – HiPerFET Power MOSFET Q2-Class
HiPerFETTM Power
MOSFET Q2-Class
(Electrically Isolated Tab)
IXFL70N60Q2
N-Channel Enhancement Mode
Avalanche Rated, Low Qg, Low Intrinsic RG
High dV/dt, Low trr
VDSS =
ID25 =
RDS(on) ≤
trr
≤
600V
37A
92mΩ
250ns
ISOPLUS264
Symbol
VDSS
VDGR
VGSS
VGSM
ID25
IDM
IA
EAS
dV/dt
PD
TJ
TJM
Tstg
TL
T
SOLD
FC
VISOL
Weight
Test Conditions
TJ = 25°C to 150°C
TJ = 25°C to 150°C, RGS = 1MΩ
Continuous
Transient
TC = 25°C
TC = 25°C, Pulse Width Limited by TJM
TC = 25°C
TC = 25°C
IS ≤ IDM, VDD ≤ VDSS, TJ ≤ 150°C
TC = 25°C
1.6 mm (0.063 in.) from Case for 10s
Plastic body for 10s
Mounting Force
50/60 Hz, RMS t = 1 min
IISOL ≤ 1 mA
t=1s
Maximum Ratings
600
V
600
V
± 30
V
± 40
V
37
A
280
A
35
A
5
J
20
V/ns
360
W
-55 ... +150
°C
150
°C
-55 ... +150
°C
300
°C
260
°C
40..120 / 9..27
N/lb.
2500
V~
3000
V~
8
g
Symbol
Test Conditions
(TJ = 25°C, Unless Otherwise Specified)
BVDSS
VGS = 0 V, ID = 1mA
VGS(th)
VDS = VGS, ID = 8mA
IGSS
VGS = ±30 V, VDS = 0V
IDSS
VDS = VDSS, VGS = 0V
RDS(on)
VGS = 10V, ID = 35A, Note 1
TJ = 125°C
Characteristic Values
Min. Typ. Max.
600
V
3.0
5.5 V
± 200 nA
100 μA
5 mA
92 mΩ
G
D
S
G = Gate
S = Source
ISOLATED TAB
D = Drain
Features
z Silicon Chip on Direct-Copper Bond
(DCB) Substrate
z Isolated Mounting Surface
z 2500V Electrical Isolation
z Fast Intrinsic Diode
z Avalanche Rated
z Low QG
z Low Package Inductance
Advantages
z High Power Density
z Easy to Mount
z Space Savings
Applications
z DC-DC Converters
z Battery Chargers
z Switched-Mode and Resonant-Mode
Power Supplies
z DC Choppers
z Temperature and Lighting Controls
© 2009 IXYS CORPORATION, All Rights Reserved
DS100068A(06/09)