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IXFK360N10T Datasheet, PDF (1/6 Pages) IXYS Corporation – GigaMOS Trench HiperFET Power MOSFET
Preliminary Technical Information
GigaMOSTM Trench
HiperFETTM
Power MOSFET
N-Channel Enhancement Mode
Avalanche Rated
Fast Intrinsic Diode
IXFK360N10T
IXFX360N10T
VDSS =
ID25 =
RDS(on) ≤
trr
≤
100V
360A
2.9mΩ
130ns
TO-264 (IXFK)
Symbol
VDSS
VDGR
VGSS
VGSM
ID25
IL(RMS)
IDM
IA
EAS
PD
dv/dt
TJ
TJM
Tstg
TL
TSOLD
Md
FC
Weight
Test Conditions
TJ = 25°C to 175°C
TJ = 25°C to 175°C, RGS = 1MΩ
Continuous
Transient
TC = 25°C (Chip Capability)
External Lead Current Limit
TC = 25°C, Pulse Width Limited by TJM
TC = 25°C
TC = 25°C
TC = 25°C
IS ≤ IDM, VDD ≤ VDSS, TJ ≤ 175°C
1.6mm (0.062 in.) from Case for 10s
Plastic Body for 10s
Mounting Torque (TO-264)
Mounting Force (PLUS247)
TO-264
PLUS247
Maximum Ratings
100
V
100
V
± 20
V
± 30
V
360
A
160
A
900
A
100
A
3
J
1250
W
20
V/ns
-55 ... +175
°C
175
°C
-55 ... +175
°C
300
°C
260
°C
1.13/10
20..120 /4.5..27
Nm/lb.in.
N/lb.
10
g
6
g
Symbol
Test Conditions
(TJ = 25°C Unless Otherwise Specified)
BVDSS
VGS = 0V, ID = 1mA
Characteristic Values
Min. Typ. Max.
100
V
VGS(th)
VDS = VGS, ID = 3mA
2.5
4.5 V
IGSS
VGS = ± 20V, VDS = 0V
± 200 nA
IDSS
VDS = VDSS, VGS = 0V
TJ = 150°C
25 μA
2.5 mA
RDS(on)
VGS = 10V, ID = 100A, Notes 1 & 2
2.9 mΩ
G
D
Tab
S
PLUS247 (IXFX)
G
D
S
G = Gate
S = Source
Tab
D = Drain
Tab = Drain
Features
z International Standard Packages
z High Current Handling Capability
z Fast Intrinsic Diode
z Avalanche Rated
z Low RDS(on)
Advantages
z Easy to Mount
z Space Savings
z High Power Density
Applications
z Synchronous Recification
z DC-DC Converters
z Battery Chargers
z Switch-Mode and Resonant-Mode
Power Supplies
z DC Choppers
z AC Motor Drives
z Uninterruptible Power Supplies
z High Speed Power Switching
Applications
© 2011 IXYS CORPORATION, All Rights Reserved
DS100210A(02/11)