IXFK30N50Q Datasheet, PDF (1/4 Pages) IXYS Corporation – HiPerFET Power MOSFETs Q-Class

HiPerFET^TM
Power MOSFETs
Q-Class
IXFK/IXFX 30N50Q
IXFK/IXFX 32N50Q
N-Channel Enhancement Mode
Avalanche Rated, Low Q_g, High dv/dt
VI
DSS D25
500 V 30 A
500 V 32 A
R
DS(on)
0.16 Ω
0.15 Ω
t_rr ≤ 250 ns
Symbol
V_DSS
V_DGR
V
GS
V
GSM
I_D25
I_DM
I_AR
E
AR
E_AS
dv/dt
P
D
T_J
T
JM
T_stg
T_L
M_d
Weight
Symbol
V_DSS
V_GS(th)
I_GSS
I_DSS
R_DS(on)
Test Conditions
Maximum Ratings
T_J = 25°C to 150°C
T_J = 25°C to 150°C; R_GS = 1 MΩ
Continuous
Transient
500
500
±20
±30
T_C = 25°C
T_C = 25°C,
pulse width limited by T_JM
T_C = 25°C
T
C
= 25°C
30N50Q
30
32N50Q
32
30N50Q
120
32N50Q
128
32
45
1500
I_S ≤ I_DM, di/dt ≤ 100 A/µs, V_DD ≤ V_DSS,
T_J ≤ 150°C, R_G = 2 Ω
T
C
= 25°C
5
416
-55 ... + 150
150
-55 ... + 150
1.6 mm (0.063 in) from case for 10 s
300
Mounting torque
1.13/10
V
V
V
V
A
A
A
A
A
mJ
mJ
V/ns
W
°C
°C
°C
°C
Nm/lb.in.
TO-247
TO-268
6
g
4
g
Test Conditions
V_GS = 0 V, I_D = 250 uA
V_DS = V_GS, I_D = 4 mA
V_GS = ±20 V_DC, V_DS = 0
V_DS = V_DSS
V_GS = 0 V
V_GS = 10 V, I_D = 0.5 I_D25
Note 1
Characteristic Values
(T_J = 25°C, unless otherwise specified)
min. typ. max.
500
V
2.5
4.5 V
T_J = 25°C
T_J = 125°C
32N50Q
30N50Q
±100 nA
100 µA
1 mA
0.15 Ω
0.16 Ω
PLUS 247^TM
(IXFK)
G
D
TO-264 AA (IXFK)
(TAB)
G
D
S
(TAB)
G = Gate
S = Source
D = Drain
TAB = Drain
Features
l _{IXYS advanced low Qg process}
l _{Low gate charge and capacitances}
- easier to drive
- faster switching
l _{International standard packages}
l _{Low RDS (on)}
l _{Unclamped Inductive Switching (UIS)}
rated
l _{Molding epoxies meet UL 94 V-0}
flammability classification
Advantages
l _{PLUS 247}TM _{package for clip or spring}
mounting
l _{Space savings}
l _{High power density}
© 2002 IXYS All rights reserved
98604D (06/02)