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IXFK180N10_09 Datasheet, PDF (1/5 Pages) IXYS Corporation – HiperFET Power MOSFETs
HiperFETTM Power
MOSFETs
Single MOSFET Die
N-Channel Enhancement Mode
Avalanche Rated
Fast Intrinsic Diode
IXFK180N10
IXFX180N10
VDSS =
ID25 =
≤ RDS(on)
100V
180A
8mΩ
TO-264 (IXFK)
Symbol
VDSS
VDGR
VGSS
VGSM
ID25
ILRMS
IDM
IA
EAS
dV/dt
PD
TJ
TJM
Tstg
TL
TSOLD
Md
Weight
Test Conditions
TJ = 25°C to 150°C
TJ = 25°C to 150°C, RGS = 1MΩ
Continuous
Transient
TC = 25°C ( Chip Capabitlty)
Leads Current Limit, RMS
TC = 25°C, Pulse Width Limited by TJM
TC = 25°C
TC = 25°C
IS ≤ IDM, VDD ≤ VDSS, TJ ≤ 150°C
TC = 25°C
1.6mm (0.062 in.) from Case for 10s
Plastic Body for 10s
Mounting Force
MountingTorque
(PLUS247)
(TO-264)
PLUS247
TO-264
Maximum Ratings
100
V
100
V
±20
V
±30
V
180
A
160
A
720
A
180
A
3
J
5
V/ns
560
W
-55 ... +150
150
-55 ... +150
300
260
20..120/4.5..27
1.13/10
6
10
°C
°C
°C
°C
°C
N/lb.
Nm/lb.in.
g
g
Symbol
Test Conditions
(TJ = 25°C, Unless Otherwise Specified)
BVDSS
VGS = 0V, ID = 3mA
VGS(th)
VDS = VGS, ID = 8mA
IGSS
VGS = ±20V, VDS = 0V
IDSS
VDS = VDSS
VGS = 0V
TJ = 125°C
RDS(on)
VGS = 10V, ID = 0.5 • ID25, Note 1
Characteristic Values
Min. Typ. Max.
100
V
2.0
4.0 V
±100 nA
100 μA
2 mA
8 mΩ
G
D
S
PLUS247 (IXFX)
(TAB)
G = Gate
S = Source
(TAB)
D = Drain
TAB = Drain
Features
z International Standard Packages
z High Current Handling Capability
z Avalanche Rated
z Low RDS(on) HDMOSTM Process
z Fast intrinsic diode
z Low Package Inductance
Advantages
z Easy to Mount
z Space Savings
z High Power Density
Applications
z DC-DC Converters
z Battery Chargers
z Switched-Mode and Resonant-Mode
Power Supplies
z DC Choppers
z AC Motor Drives
z Temperature and Lighting Controls
© 2009 IXYS CORPORATION, All Rights Reserved
DS98552D(02/09)