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IXFC14N60P Datasheet, PDF (1/5 Pages) IXYS Corporation – PolarHV HiPerFET Power MOSFET
PolarHVTM HiPerFET
Power MOSFET
IXFC14N60P
(Electrically Isolated Back Surface)
N-Channel Enhancement Mode
Avalanche Rated
Fast Intrinsic Diode
Symbol
VDSS
VDGR
VGSS
VGSM
ID25
IDM
IA
EAS
dV/dt
PD
TJ
TJM
Tstg
TL
TSOLD
VISOL
Md
Weight
Test Conditions
TJ = 25°C to 150°C
TJ = 25°C to 150°C, RGS = 1MΩ
Continuous
Transient
Maximum Ratings
600
V
600
V
±30
V
±40
V
TC = 25°C
TC = 25°C, pulse width limited by TJM
TC = 25°C
TC = 25°C
8
A
42
A
14
A
900
mJ
IS ≤ IDM, VDD ≤ VDSS, TJ ≤ 150°C
TC = 25°C
10
125
-55 ... +150
150
-55 ... +150
V/ns
W
°C
°C
°C
1.6mm (0.062 in.) from case for 10s
300
Plastic body for 10s
260
50/60 Hz, RMS
t = 1min
2500
IISOL ≤ 1mA
t = 1s
3000
Mounting force
11..66 / 2.5..14.6
°C
°C
V~
V~
N/lb.
2
g
Symbol
Test Conditions
(TJ = 25°C, unless otherwise specified)
BVDSS
VGS = 0V, ID = 250μA
VGS(th)
VDS = VGS, ID = 2.5mA
IGSS
VGS = ±30V, VDS = 0V
IDSS
VDS = VDSS
VGS = 0V
RDS(on)
VGS = 10V, ID = 7A, Note 1
TJ = 125°C
Characteristic Values
Min. Typ. Max.
600
V
3.0
5.5 V
±100 nA
5 μA
500 μA
630 mΩ
VDSS =
ID25 =
≤ RDS(on)
t
rr
≤
600V
8A
630mΩ
200ns
ISOPLUS 220TM
E153432
G
DS
G = Gate
S = Source
Isolated Tab
D = Drain
Features
UL recognized package
Silicon chip on Direct-Copper-Bond
substrate
- High power dissipation
- Isolated mounting surface
- 2500V electrical isolation
Avanlache rated
Fast intrinsic diode
Advantages
Easy to mount
Space savings
High power density
Applications:
Switched-mode and resonant-mode
power supplies
DC-DC Converters
Laser Drivers
AC and DC motor drives
Robotics and servo controls
© 2008 IXYS CORPORATION, All rights reserved
DS99409F(12/08)