CPC1967 Datasheet, PDF (1/7 Pages) Clare, Inc. – i4-PAC™ Power Relay

INTEGRATED CIRCUITS DIVISION
CPC1967
400V Single-Pole, Normally Open
Power Relay
Characteristics
Parameter
Blocking Voltage
Load Current, T_A=25°C:
With 5°C/W Heat Sink
No Heat Sink
On-Resistance (max)
Thermal Resistance,
Junction-to-Case, _JC
Rating
400
3.35
1.35
0.85
0.35
Units
V_P
A_rms / A_DC

°C/W
Features
• 3.35A_rms Load Current with 5°C/W Heat Sink
• Low 0.85 On-Resistance
• 400V_P Blocking Voltage
• 2500V_rms Input/Output Isolation
• Low Thermal Resistance: _JC = 0.35 °C/W
• Isolated, Low Thermal Impedance Ceramic Pad for
Heat Sink Applications
• Low Drive Power Requirements
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
Applications
• Industrial Controls / Motor Control
• Robotics
• Medical Equipment—Patient/Equipment Isolation
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Transportation Equipment
• Aerospace/Defense
Approvals
• UL 508 Recognized Component: File E69938
Pin Configuration
Description
IXYS Integrated Circuits Division and IXYS have
combined to bring OptoMOS® technology, reliability
and compact size to a new family of high power Solid
State Relays.
As part of this family, the CPC1967 single-pole
normally open (1-Form-A) Solid State Power Relay is
rated for up to 3.35A_rms continuous load current with a
5°C/W heat sink.
The CPC1967 employs optically coupled MOSFET
technology to provide 2500V_rms of input to output
isolation. The optically coupled outputs, that use
patented OptoMOS architecture, are controlled by a
highly efficient infrared LED. The combination of low
on-resistance and high load current handling
capability makes this relay suitable for a variety of high
performance switching applications.
The unique i4-PAC package pioneered by IXYS
enables Solid State Relays to achieve the highest load
current and power ratings. This package features a
unique IXYS process where the silicon chips are soft
soldered onto the Direct Copper Bond (DCB)
substrate instead of the traditional copper leadframe.
The DCB ceramic, the same substrate used in high
power modules, not only provides 2500V_rms isolation,
but also very low junction-to-case thermal resistance
(0.35 °C/W).
Ordering Information
Part
CPC1967J
Description
i4-PAC Package (25 per tube)
Switching Characteristics
Form-A
I_F
I
LOAD
90%
t_on
10%
t_off
e3
DS-CPC1967-R08
www.ixysic.com
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