CPC1927 Datasheet, PDF (1/7 Pages) Clare, Inc. – ISOPLUS™-264 Power Relay

INTEGRATED CIRCUITS DIVISION
Characteristics
Parameter
Blocking Voltage
Load Current, T_A=25°C:
With 5°C/W Heat Sink
No Heat Sink
On-Resistance (max)
Thermal Resistance,
Junction-to-Case, _JC
Rating
250
6.7
2.7
0.2
0.3
Units
V_P
A_rms / A_DC

°C/W
Features
• 6.7A_rms Load Current with 5°C/W Heat Sink
• Low 0.2 On-Resistance
• 250V_P Blocking Voltage
• 2500V_rms Input/Output Isolation
• Low Thermal Resistance: _JC = 0.3 °C/W
• Isolated, Low Thermal Impedance Ceramic Pad for
Heat Sink Applications
• Low Drive Power Requirements
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
Applications
• Industrial Controls / Motor Control
• Robotics
• Medical Equipment—Patient/Equipment Isolation
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Transportation Equipment
• Aerospace/Defense
Approvals
• UL 508 Certified Component: File E69938
Pin Configuration
CPC1927
250V Single-Pole, Normally Open
Power Relay
Description
IXYS Integrated Circuits Division and IXYS have
combined to bring OptoMOS® technology, reliability
and compact size to a new family of high-power Solid
State Relays.
As part of this family, the CPC1927 single-pole
normally open (1-Form-A) Solid State Power Relay is
rated for up to 6.7A_rms continuous load current with a
5°C/W heat sink.
The CPC1927 employs optically coupled MOSFET
technology to provide 2500V_rms of input to output
isolation. The optically coupled outputs, that use
patented OptoMOS architecture, are controlled by a
highly efficient infrared LED. The combination of low
on-resistance and high load current handling
capability makes this relay suitable for a variety of high
performance switching applications.
The unique ISOPLUS-264 package pioneered by
IXYS enables Solid State Relays to achieve the
highest load current and power ratings. This package
features a unique IXYS process where the silicon
chips are soft soldered onto the Direct Copper Bond
(DCB) substrate instead of the traditional copper
leadframe. The DCB ceramic, the same substrate
used in high power modules, not only provides
2500V_rms isolation but also very low junction-to-case
thermal resistance (0.3 °C/W).
Ordering Information
Part
CPC1927J
Description
ISOPLUS-264 Package (25 per tube)
Switching Characteristics
Form-A
I_F
I_LOAD
90%
t_on
10%
t_off
e3
DS-CPC1927-R06
www.ixysic.com
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