CPC1777 Datasheet, PDF (1/7 Pages) Clare, Inc. – i4-PAC™ DC Power Relay

INTEGRATED CIRCUITS DIVISION
Characteristics
Parameter
Blocking Voltage
Load Current, T_A=25°C:
With 5°C/W Heat Sink
No Heat Sink
On-Resistance (max)
Thermal Resistance,
Junction-to-Case, _JC
Rating
600
4.6
1.5
0.5
0.35
Units
V_P
A_DC

°C/W
Features
• 4.6A_DC Load Current with 5°C/W Heat Sink
• Low 0.5On-Resistance
• 600V_P Blocking Voltage
• 2500V_rms Input/Output Isolation
• Low Thermal Resistance: _JC = 0.35 °C/W
• Isolated, Low Thermal Impedance Ceramic Pad for
Heat Sink Applications
• Low Drive Power Requirements
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
Applications
• Industrial Controls / Motor Control
• Robotics
• Medical Equipment—Patient/Equipment Isolation
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Utility Meters (Watt-Hour, Water, Gas)
• Transportation Equipment
• Aerospace/Defense
Approvals
• UL 508 Certified Component: File E69938
Pin Configuration
1
2
+
-
34
-
+
e3
CPC1777
600V Single-Pole, Normally Open
DC-Only Power Relay
Description
IXYS Integrated Circuits Division and IXYS have
combined to bring OptoMOS® technology, reliability
and compact size to a new family of High Power Solid
State Relays. As part of this new family, the CPC1777
single-pole normally open (1-Form-A) DC Solid State
Relay employs optically coupled MOSFET technology
to provide 2500V_rms of input to output isolation.
The optically coupled outputs, that use patented
OptoMOS architecture, are controlled by a highly
efficient infrared LED. The combination of low
on-resistance and high load current handling
capability makes this relay suitable for a variety of high
performance DC switching applications.
The unique i4-PAC package pioneered by IXYS
enables solid state relays to achieve the highest load
current and power ratings. This package features an
IXYS unique process where the silicon chips are soft
soldered onto the Direct Copper Bond (DCB)
substrate instead of the usual copper leadframe. The
DCB ceramic, the same substrate used in high power
modules, not only provides 2500V_rms isolation but also
very low junction-to-case thermal resistance
(0.35°C/W).
Ordering Information
Part
CPC1777J
Description
i4-PAC Package (25 per tube)
Switching Characteristics
Form-A
I_F
I_LOAD
90%
t_on
10%
t_off
DS-CPC1777-R08
www.ixysic.com
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