CPC1709 Datasheet, PDF (1/7 Pages) Clare, Inc. – ISOPLUS™-264 DC Power Relay

INTEGRATED CIRCUITS DIVISION
Characteristics
Parameter
Blocking Voltage
Load Current, T_A=25°C:
With 5°C/W Heat Sink
No Heat Sink
On-Resistance (max)
Thermal Resistance,
Junction-to-Case, _JC
Rating
60
22.8
9
0.05
0.3
Units
V_P
A_DC

°C/W
Features
• 22.8A_DC Load Current with 5°C/W Heat Sink
• Low 0.05 On-Resistance
• 60V_P Blocking Voltage
• 2500V_rms Input/Output Isolation
• Low Thermal Resistance: _JC = 0.3 °C/W
• Isolated, Low Thermal Impedance Ceramic Pad for
Heat Sink Applications
• Low Drive Power Requirements
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
Applications
• Industrial Controls / Motor Control
• Robotics
• Medical Equipment—Patient/Equipment Isolation
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Transportation Equipment
• Aerospace/Defense
Approvals
• UL 508 Certified Component: File E69938
• CSA Certified Component: Certificate 1172007
Pin Configuration
1
2
+
-
34
-
+
CPC1709
60V Single-Pole, Normally Open
DC-Only Power Relay
Description
IXYS Integrated Circuits Division and IXYS have
combined to bring OptoMOS® technology, reliability
and compact size to a new family of high-power Solid
State Relays.
As part of this family, the CPC1709 single-pole
normally open (1-Form-A) DC Solid State Power
Relay employs optically coupled MOSFET technology
to provide 2500V_rms of input to output isolation.
The output, constructed with an efficient MOSFET
switch and photovoltaic die, uses IXYS Integrated
Circuits Division’s patented OptoMOS architecture
while the input, a highly efficient infrared LED,
provides the optically coupled control. The
combination of low on-resistance and high load
current handling capability makes this relay suitable
for a variety of high performance DC switching
applications.
The unique ISOPLUS-264 package pioneered by
IXYS enables Solid State Relays to achieve the
highest load current and power ratings. This package
features a unique IXYS process where the silicon
chips are soft soldered onto the Direct Copper Bond
(DCB) substrate instead of the traditional copper
leadframe. The DCB ceramic, the same substrate
used in high power modules, not only provides
2500V_rms isolation but also very low junction-to-case
thermal resistance (0.3 °C/W).
Ordering Information
Part
CPC1709J
Description
ISOPLUS-264 Package (25 per tube)
Switching Characteristics
Form-A
I_F
I_LOAD
90%
t_on
10%
t_off
DS-CPC1709-R08
www.ixysic.com
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