CCM03-3517 Datasheet, PDF (1/8 Pages) ITT Industries – CCM03-3517

CCM03 MK II
A new range of CCM03 connectors
Construction
have been developed to interface with
SIM/SAM cards as defined by GSM11- ^Contacts
11 and ENV1375-1. The connectors are ^Plating
available with either hinged covers or
fixed covers and have been designed to ^Moldings
minimize the amount of space needed ^{Slide lock/metal cover}
for PCB mounting.
Mechanical Data
Features
Number of Contacts
Hinged Cover
Mechanical life, hinged cover
• Available with 6 or 8 contacts, with or
without PCB locating pegs.
Mechanical life, fixed cover
Card insertion force
• Available with insulated card presence ^{Card extraction force}
switch.
Contact force
• The cover springs open when
unlocked while the card is in place.
Slide locking force
Vibration
• The molding is polarized so that the
cover can only be closed if the card is
correctly inserted.
Shock
• The cover can be replaced without
removing the connector from the PCB. Contact Electrical Data
• Inspection slots allow an electrical test
to be made without opening the cover.
• The overall height of the connector is
only 2,5 mm. The amount of space
needed to mount the connector is just
29,65 mm x 17,2 mm.
Fixed Cover
• Available with 6 or 8 contacts.
• The overall height of the connector is
2,85 mm max. Only 25,5 mm x 17,2
mm of board space is required to
mount the connector.
General
Insulation resistance
Resistance
Current rating
Dielectric strength
Switch Electrical Data
Card detection switch
Contact resistance
Dielectric strength
Current rating
Maximum power
Environmental Data
Operating temperature
Soldering temperature
• With tape and reel packaging as stan- _{Damp heat}
dard, the connectors are designed to _{Salt mist}
be automatically pick-and-placed.
• The high temperature thermoplastic
moldings are suited for infrared and
convection soldering processes.
Packaging
Quantity per reel, see table next page.
• By using an inlay finish in the contact
area the life of the precious metal is
extended by over 10 times that of
standard gold plating.
• Robustly formed printed circuit tails
allow a co-planarity of ± 0,05 mm to
be maintained.
19
Copper alloy
Contact area : Gold alloy inlay or gold over nickel
Terminals : Tin lead (2µ min)
High temp. thermoplastic UL 94V-0 rated
Stainless steel
6 or 8
10,000 cycles min
50,000 cycles
Hinged cover: 1 N max
Fixed cover: 3 N max
Hinged cover: 1 N max
Fixed cover: 0.80 N min / 3 N max
0.25 N min / 0.50 N max
2 N min / 6 N max
Frequency 10 to 500 Hz. Acceleration 50m/s²
Duration 6 hours - amplitude 0,35 mm
Max electrical discontinuity 1µs
Peak value 500 m/s² – Duration 11 ms
3 shocks in each direction of each axis
Max electrical discontinuity 1 µs
1,000 MΩ min
100 mΩ max
10 µA min / 1 A max
750 Vrms min
Normally open
100 mΩ max
250 Vrms min
1 mA min / 10m A max
0.2 VA
-40°C to +85°C
Temperature/time profile acc. to CECC00802
para. 6.1, Fig. 3 with peak temperature 250°C
IEC 512 test number 11c (10 days)
IEC 512 test number 11f (96 hours)
Dimensions are shown in mm
Dimensions subject to change
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