IS43DR16128 Datasheet, PDF (9/26 Pages) Integrated Silicon Solution, Inc – 2Gb (x16) DDR2 SDRAM

IS43/46DR16128
Clock Enable (CKE) Truth Table
Current State⁽²⁾
CKE
Previous Cycle⁽¹⁾(N-1) Current Cycle⁽¹⁾(N)
Command (N)⁽³⁾
RAS#, CAS#, WE#, CS#
Action (N)⁽³⁾
Notes
Power Down
L
L
L
X
Maintain Power-Down
11, 13, 15
H
Deselect or NOP
Power Down Exit
4, 8, 11, 13
Self Refresh
L
L
L
X
Maintain Self-Refresh
11, 15, 16
H
Deselect or NOP
Self-Refresh Exit
4, 5, 9, 16
Bank(s) Active
H
L
Deselect or NOP
Active Power Down Entry
4, 8, 10, 11, 13
All Banks Idle
H
H
L
Deselect or NOP
Precharge Power Down Entry 4, 8, 10, 11, 13
L
Refresh
Self-Refresh Entry
6, 9, 11, 13
H
H
Refer to the Command Truth Table
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Notes:
1. CKE (N) is the logic state of CKE at clock edge N; CKE (N–1) was the state of CKE at the previous clock edge.
2. Current state is the state of the DDR2 SDRAM immediately prior to clock edge N.
3. COMMAND (N) is the command registered at clock edge N, and ACTION (N) is a result of COMMAND (N).
4. All states and sequences not shown are illegal or reserved unless explicitly described elsewhere in this document.
5. On Self Refresh Exit, DESELECT or NOP commands must be issued on every clock edge occurring during the tXSNR period. Read commands may be issued only
after tXSRD (200 clocks) is satisfied.
6. Self Refresh mode can only be entered from the All Banks Idle state.
7. Must be a legal command as defined in the Command Truth Table.
8. Valid commands for Power Down Entry and Exit are NOP and DESELECT only.
9. Valid commands for Self Refresh Exit are NOP and DESELECT only.
10. Power Down and Self Refresh cannot be entered while Read or Write operations, (Extended) Mode Register Set operations or Precharge operations are in
progress.
11. tCKEmin of 3 clocks means CKE must be registered on three consecutive positive clock edges. CKE must remain at the valid input level the entire time it takes to
achieve the 3 clocks of registration. Thus, after any CKE transition, CKE may not transition from its valid level during the time period of tIS + 2 x tCK + tIH.
12. The state of ODT does not affect the states described in this table. The ODT function is not available during Self Refresh.
13. The Power Down does not perform any refresh operations. The duration of Power Down Mode is therefore limited by the refresh requirements outlined in this
datasheet.
14. CKE must be maintained HIGH while the DDRII SDRAM is in OCD calibration mode.
15. “X” means “Don’t Care (including floating around VREF)” in Self Refresh and Power Down. However ODT must be driven HIGH or LOW in Power Down if the ODT
function is enabled (Bit A2 or A6 set to “1” in EMR[1] ).
16. VREF must be maintained during Self Refresh operation.
Data Mask (DM) Truth Table
Name (Functional)
DM
Write Enable
L
Write Inhibit
H
Note:
1. Used to mask write data, provided coincident with the corresponding data.
DQs
Valid
X
Note
1
1
Functional Block Diagram
Integrated Silicon Solution, Inc. – www.issi.com –
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Rev. B, 09/6/2012