IS49NLC93200 Datasheet, PDF (1/34 Pages) Integrated Silicon Solution, Inc – 288Mb (x9, x18, x36) Common I/O RLDRAM 2 Memory

IS49NLC93200,IS49NLC18160,IS49NLC36800
288Mb (x9, x18, x36) Common I/O RLDRAM^® 2 Memory
ADVANCED INFORMATION
JUNE 2012
FEATURES
• 533MHz DDR operation (1.067 Gb/s/pin data
rate)
• 38.4Gb/s peak bandwidth (x36 at 533 MHz
clock frequency)
• Reduced cycle time (15ns at 533MHz)
• 32ms refresh (8K refresh for each bank; 64K
refresh command must be issued in total each
32ms)
• 8 internal banks
• Non-multiplexed addresses (address
multiplexing option available)
• SRAM-type interface
• Programmable READ latency (RL), row cycle
time, and burst sequence length
• Balanced READ and WRITE latencies in order to
optimize data bus utilization
• Data mask signals (DM) to mask signal of
WRITE data; DM is sampled on both edges of
DK.
• Differential input clocks (CK, CK#)
• Differential input data clocks (DKx, DKx#)
• On-die DLL generates CK edge-aligned data and
output data clock signals
• Data valid signal (QVLD)
• HSTL I/O (1.5V or 1.8V nominal)
• 25-60Ω matched impedance outputs
• 2.5V V_EXT, 1.8V V_DD, 1.5V or 1.8V V_DDQ I/O
• On-die termination (ODT) R_TT
• IEEE 1149.1 compliant JTAG boundary scan
• Operating temperature:
Commercial
(T_C = 0° to +95°C; T_A = 0°C to +70°C),
Industrial
(T_C = -40°C to +95°C; T_A = -40°C to +85°C)
OPTIONS
• Package:
− 144-ball FBGA (leaded)
− 144-ball FBGA (lead-free)
• Configuration:
− 32Mx9
− 16Mx18
− 8Mx36
• Clock Cycle Timing:
Speed Grade
-18
-25E
-25
-33
-5
Unit
t_RC
15
15
20
20
20
ns
t_CK
1.875
2.5
2.5
3.3
5
ns
Copyright © 2012 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without
notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the
latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can
reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such
applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
RLDRAM^® is a registered trademark of Micron Technology, Inc.
Integrated Silicon Solution, Inc. – www.issi.com –
Rev. 00F, 06/20/2012
1