IS43DR86400C Datasheet, PDF (1/48 Pages) Integrated Silicon Solution, Inc – 64Mx8, 32Mx16 DDR2 DRAM

IS43/46DR86400C
IS43/46DR16320C
64Mx8, 32Mx16 DDR2 DRAM
PRELIMINARY INFORMATION
NOVEMBER 2012
FEATURES
• Vdd = 1.8V ±0.1V, Vddq = 1.8V ±0.1V
• JEDEC standard 1.8V I/O (SSTL_18-compatible)
• Double data rate interface: two data transfers
per clock cycle
• Differential data strobe (DQS, DQS)
DESCRIPTION
ISSI's 512Mb DDR2 SDRAM uses a double-data-rate
architecture to achieve high-speed operation. The
double-data rate architecture is essentially a 4n-prefetch
architecture, with an interface designed to transfer two
data words per clock cycle at the I/O balls.
• 4-bit prefetch architecture
• On chip DLL to align DQ and DQS transitions
with CK
• 4 internal banks for concurrent operation
• Programmable CAS latency (CL) 3, 4, 5, and 6
supported
ADDRESS TABLE
Parameter
64M x 8
Configuration
16M x 8 x 4
banks
Refresh Count 8K/64ms
32M x 16
8M x 16 x 4
banks
8K/64ms
• Posted CAS and programmable additive latency
(AL) 0, 1, 2, 3, 4, and 5 supported
• WRITE latency = READ latency - 1 tCK
• Programmable burst lengths: 4 or 8
• Adjustable data-output drive strength, full and
reduced strength options
Row Addressing
Column
Addressing
Bank Addressing
Precharge
Addressing
16K (A0-A13) 8K (A0-A12)
1K (A0-A9) 1K (A0-A9)
BA0, BA1
A10
BA0, BA1
A10
• On-die termination (ODT)
OPTIONS
• Configuration(s):
64Mx8 (16Mx8x4 banks) IS43/46DR86400C
32Mx16 (8Mx16x4 banks) IS43/46DR16320C
• Package:
x8: 60-ball BGA (8mm x 10.5mm)
x16: 84-ball WBGA (8mm x 12.5mm)
Timing – Cycle time
2.5ns @CL=5 DDR2-800D
2.5ns @CL=6 DDR2-800E
3.0ns @CL=5 DDR2-667D
3.75ns @CL=4 DDR2-533C
KEY TIMING PARAMETERS
Speed Grade -25D -3D
tRCD
12.5 15
tRP
12.5 15
tRC
55 55
tRAS
40 40
tCK @CL=3
5
5
tCK @CL=4
3.75 3.75
tCK @CL=5
2.5 3
tCK @CL=6
2.5 —
5ns @CL=3 DDR2-400B
• Temperature Range:
Commercial (0°C ≤ Tc ≤ 85°C)
Industrial (-40°C ≤ Tc ≤ 95°C; -40°C ≤ Ta ≤ 85°C)
Automotive, A1 (-40°C ≤ Tc ≤ 95°C; -40°C ≤ Ta ≤ 85°C)
Automotive, A2 (-40°C ≤ Tc; Ta ≤ 105°C)
Tc = Case Temp, Ta = Ambient Temp
Copyright © 2012 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without
notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the lat-
est version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reason-
ably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications
unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc. — www.issi.com
1
Rev. 0A
11/20/2012