IS42SM32160C Datasheet, PDF (1/17 Pages) Integrated Silicon Solution, Inc – 512Mb Mobile Synchronous DRAM

IS42SM32160C
IS42RM32160C
16Mx32
512Mb Mobile Synchronous DRAM
NOVEMBER 2010
FEATURES:
• Fully synchronous; all signals referenced to a
positive clock edge
• Internal bank for hiding row access and pre-
charge
• Programmable CAS latency: 2, 3
• Programmable Burst Length: 1, 2, 4, 8, and Full
Page
• Programmable Burst Sequence:
• Sequential and Interleave
• Auto Refresh (CBR)
• TCSR (Temperature Compensated Self Refresh)
• PASR (Partial Arrays Self Refresh): 1/16, 1/8,
1/4, 1/2, and Full
• Deep Power Down Mode (DPD)
• Driver Strength Control (DS): 1/4, 1/2, and Full
OPTIONS:
• Configuration: 16Mx32
• Power Supply:
IS42SMxxx - Vdd/Vddq = 3.3V
IS42RMxxx - Vdd/Vddq = 2.5V
• Package: 90 Ball BGA (8x13mm)
• Temperature Range:
Commercial (0^oC to +70^oC)
Industrial (-40^oC to +85^oC)
• Die revision: C
DESCRIPTION:
ISSI's IS42SM/RM32160C is a 512Mb Mobile Syn-
chronous DRAM configured as a quad 4M x32 DRAM.
It achieves high-speed data transfer using a pipeline
architecture with a synchronous interface. All inputs and
outputs signals are registered on the rising edge of the
clock input, CLK. The 512Mb SDRAM is internally con-
figured by stacking two 256Mb, 16Mx16 devices. Each
of the 4M x32 banks is organized as 8192 rows by 512
columns by 32 bits.
KEY TIMING PARAMETERS
Parameter
-7 -75 Unit
CLK Cycle Time
CAS Latency = 3
7 7.5 ns
CAS Latency = 2
9.6 9.6 ns
CLK Frequency
CAS Latency = 3
CAS Latency = 2
143 133 Mhz
104 104 Mhz
Access Time from CLK
CAS Latency = 3
CAS Latency = 2
5.4 5.4 ns
7
7 ns
ADDRESS TABLE
Parameter
Configuration
Bank Address Pins
Autoprecharge Pins
Row Addresses
Column Addresses
Refresh Count
16Mx32
4M x 32 x 4 banks
BA0, BA1
A10/AP
A0 – A12
A0 – A8
8K / 64ms
Copyright © 2010 Integrated Silicon Solution, Inc.All rights reserved.ISSI reserves the right to make changes to this specification and its products at any time without
notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the lat-
est version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reason-
ably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications
unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc.
1
Rev.  A
11/09/2010