IS42S83200J Datasheet, PDF (1/63 Pages) Integrated Silicon Solution, Inc – 256Mb SYNCHRONOUS DRAM

IS42S83200J, IS42S16160J
IS45S83200J, IS45S16160J
32Meg x 8, 16Meg x16
256Mb SYNCHRONOUS DRAM
ADVANCED INFORMATION
MARCH 2013
FEATURES
• Clock frequency: 166, 143MHz
• Fully synchronous; all signals referenced to a
positive clock edge
• Internal bank for hiding row access/precharge
• Single Power supply: 3.3V + 0.3V
• LVTTL interface
• Programmable burst length
– (1, 2, 4, 8, full page)
• Programmable burst sequence:
Sequential/Interleave
• Auto Refresh (CBR)
• Self Refresh
• 8K refresh cycles every 32 ms (A2 grade) or
64 ms (commercial, industrial, A1 grade)
• Random column address every clock cycle
• Programmable CAS latency (2, 3 clocks)
• Burst read/write and burst read/single write
operations capability
• Burst termination by burst stop and precharge
command
OPTIONS
• Package:
54-pin TSOP-II
54-ball BGA
• Operating Temperature Range:
Commercial (0^oC to +70^oC)
Industrial (-40^oC to +85^oC)
Automotive Grade A1 (-40^oC to +85^oC)
Automotive Grade A2 (-40^oC to +105^oC)
OVERVIEW
ISSI's 256Mb Synchronous DRAMachieves high-speed
data transfer using pipeline architecture. All inputs and
outputs signals refer to the rising edge of the clock input.
The 256Mb SDRAM is organized as follows.
IS42S83200G IS42S16160G
8M x 8 x 4 Banks 4M x16x4 Banks
54-pin TSOPII 54-pin TSOPII
54-ball BGA
54-ball BGA
KEY TIMING PARAMETERS
Parameter -6
-7
Unit
Clk Cycle Time
CAS Latency = 3
CAS Latency = 2
6
7
ns
10
7.5 ns
ClkFrequency
CAS Latency = 3
CAS Latency = 2
166 143 Mhz
100 133 Mhz
Access Timefrom Clock
CAS Latency = 3
5.4 5.4 ns
CAS Latency = 2
5.4 5.4 ns
ADDRESS TABLE
Parameter
32M x 8
Configuration
8M x 8 x 4
banks
Refresh Count
Com./Ind.
A1
A2
8K/64ms
8K/64ms
8K/32ms
Row Addresses
A0-A12
Column Addresses
A0-A9
Bank Address Pins
BA0, BA1
Auto Precharge Pins
A10/AP
16M x 16
4M x 16 x 4
banks
8K/64ms
8K/64ms
8K/32ms
A0-A12
A0-A8
BA0, BA1
A10/AP
Copyright © 2013 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time with-
out notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain
the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can
reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such ap-
plications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc. — www.issi.com
1
Rev. 00B
3/19/2013