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IS42S16800B Datasheet, PDF (1/60 Pages) Integrated Silicon Solution, Inc – 16Meg x 8, 8Meg x16 128-MBIT SYNCHRONOUS DRAM
IS42S81600B
IS42S16800B
16Meg x 8, 8Meg x16
128-MBIT SYNCHRONOUS DRAM
ISSI®
MAY 2006
FEATURES
• Clock frequency: 167, 143, 133 MHz
• Fully synchronous; all signals referenced to a
positive clock edge
• Internal bank for hiding row access/precharge
• Power supply
IS42S81600B
VDD VDDQ
3.3V 3.3V
IS42S16800B
3.3V 3.3V
• LVTTL interface
• Programmable burst length
– (1, 2, 4, 8, full page)
• Programmable burst sequence:
Sequential/Interleave
• Auto Refresh (CBR)
• Self Refresh with programmable refresh periods
• 4096 refresh cycles every 64 ms
• Random column address every clock cycle
• Programmable CAS latency (2, 3 clocks)
• Burst read/write and burst read/single write
operations capability
• Burst termination by burst stop and precharge
command
• Industrial Temperature Availability
• Lead-free Availability
OVERVIEW
ISSI's 128Mb Synchronous DRAM achieves high-speed
data transfer using pipeline architecture. All inputs and
outputs signals refer to the rising edge of the clock
input.The 128Mb SDRAM is organized as follows.
IS42S81600B
4M x8x4 Banks
54-pin TSOPII
IS42S16800B
2M x16x4 Banks
54-pin TSOPII
KEY TIMING PARAMETERS
Parameter
-6 -7 -75E
Unit
Clk Cycle Time
CAS Latency = 3
CAS Latency = 2
67–
ns
– 10 7.5
ns
Clk Frequency
CAS Latency = 3
CAS Latency = 2
167 143 –
Mhz
– 100 133
Mhz
Access Time from Clock
CAS Latency = 3
5.4 5.4 –
ns
CAS Latency = 2
–66
ns
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any
time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are
advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
1
Rev. E
05/01/06