TLP180 Datasheet, PDF (8/10 Pages) Toshiba Semiconductor – TOSHIBA PHOTOCOUPLER GaAs IRED & PHOTO-TRANSISTOR

ISOCOM
COMPONENTS
IS180
IR REFLOW SOLDERING TEMPERATURE PROFILE
(One Time Reflow Soldering is Recommended)
260°C
T_P
T_P - 5°C
T_L ^217°C
T_smax ^180°C
T_smin ^150°C
Max Ramp Up Rate
3°C/s
t_s Preheat
60s – 120s
t_P
Max Ramp Down Rate
6°C/s
T_L
25°C
Time 25°C to Peak Temperature
TIME (s)
Profile Details
Preheat
- Min Temperature (T_SMIN)
- Max Temperature (T_SMAX)
- Time T_SMIN to T_SMAX (t_s)
Soldering Zone
- Peak Temperature (T_P)
- Liquidous Temperature (T_L)
- Time within 5°C of Actual Peak Temperature (T_P ̶ 5°C)
- Time maintained above T_L (t_L)
- Ramp Up Rate (T_L to T_P)
- Ramp Down Rate (T_P to T_L)
Average Ramp Up Rate (T_smax to T_P)
Time 25°C to Peak Temperature
Conditions
150°C
180°C
60s - 120s
260°C
217°C
20s
60s
3°C/s max
3 - 6°C/s
3°C/s max
8 minutes max
8 24/06/2015
DC93186