SM-BGA-9041 Datasheet, PDF (4/4 Pages) Ironwood Electronics. – Highly compliant to accommodate wide co-planarity variations

1
2
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ITEM#
1
2
3
4
5
6
4
7
5
8
9
10
6
11
12
13
7
14
8
15
(behind mounting screw)
9
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13
14
1.3 (4x)
15
Description
Compression Screw M10
Socket Lid
Compression Plate
IC Frame OD 17mm ID 14mm ID 1mm R
Test Chip BGA912 17x17mm 32x32 0.5mm
Pitch
#0-80 Shoulder Screw, 0.062" thread length
Socket Base SG 17mm IC 5mm Thk
Dowel pin, 1/32" X 1/4", SS
#0-80 x 0.5, SH Cap Screw
IC Guide
Ball Guide SM-BGA912 32x32 0.5mm
SM Interposer BGA912 32x32 0.5mm Pitch
Test PCB 17x17mm 32x32 0.5mm Pitch
Insulation Plate
Backing plate for 17mm IC, 4mm thick
Material
7075-T6 Alumium Alloy
7075-T6 Aluminum Alloy
7075-T6 Aluminum Alloy
Semitron MDS 100
FR4 High temp
Stainless Steel (303)
7075-T6 (SN)
Stainless Steel (18-8)
Alloy Steel
Semitron MDS 100
Kapton Polyimide/Cirlex
SM elastomer
FR4 High temp
High Temp FR4
7075-T6 Alumium Alloy
24.725
1.59
15.000
R0.8 (16x)
7.000
4.00
Description: Socket, Backing Plate Detail
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SM-BGA-9041 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 20.00
STATUS: Released
ENG: B. Schatz
FILE: SM-BGA-9041 Dwg
Rev Date Initials Description
A 8/12/13 BJS Original
SHEET: 4 OF 4
DRAWN BY: M. Raske
DATE: 11/20/2013
REV. A
SCALE: 3:1