SS-BGA420C-01 Datasheet, PDF (3/4 Pages) Ironwood Electronics. – Minimum real estate required

Co mpatible BGA Spec
X
Y
D
DETAIL
e
E
3 Øb
Ø0.25 Z X Y
Ø0.10
0.20
TOP VIEW
A
A1
DETAIL
Z4
5
0.20 Z
0.2 Z
Target PCSBSR-eBcoGmAm4e2nd0aCtio-0ns1 Drawing
Total thickn_©es₂s₀:₀₄1._I6_Rm_ONm_Wm_Oin_O._{D ELECTRONICS, INC.}
Plating: Gold_Po_Or S_BOol_Xde₂r₁f₁i₅n₁is_Sh_{T. PAUL, MN 55121}
PCB Pad height: SamTeleo:r(6h5ig1h) e45r2th-8a1n00solder mask
www.ironwoodelectronics.com
SIDE VIEW
1. ^{Dimensions are in millimeters.}
2. ^{Interpret dimensions and toleraces per ASME}
Y14.5M-1994.
Dimension b is measured at the maximum
3 _{solder ball diameter, parallel to datum plame Z.}
Datum Z (seating plane) is defined by the
4 _{spherical crowns of the solder balls.}
5 ^{Parallelism measurement shall exclude any}
effect of mark on top surface of package.
Status: Released
Drawing: H. Hansen
File: SS-BGA420C-01 Dwg
Scale:
Rev: B
Date: 5/7/04
Modified: 1/21/05
BOTTOM VIEW
DIM
MIN
MAX
A
3.5
A1
0.4
0.6
b
0.70
D
27.00 BSC
E
27.00 BSC
e
1.0 BSC
26x26 Array
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