SS-BGA104A-01 Datasheet, PDF (3/4 Pages) Ironwood Electronics. – Minimum real estate required

E
Y
X
e
D
0.20
5
0.10 Z
A
Z₄
3 Øb
Ø0.15 M Z X M Y M
Ø0.05 M Z
0.08 Z ^A1
1. Dimensions are in millimeters.
2. ^{Interpret dimensions and toleraces per ASME}
Y14.5M-1994.
Dimension b is measured at the maximum
3 _{solder ball diameter, parallel to datum plame Z.}
Datum Z (seating plane) is defined by the
4 _{spherical crowns of the solder balls.}
Parallelism measurement shall exclude any
5 _{effect of mark on top surface of package.}
DIM
MIN
MAX
A
1.29
A1
0.17
0.27
b
0.35
D
8.00 BSC
E
8.00 BSC
e
0.5 BSC
15 x 15 Array
Target PCB RSeSco-BmGmeAn1da0t4ioAns-01 Drawing
Total thickne_©ss₂:₀1₀.₆6m_IRm_ONm_Win_O._{OD ELECTRONICS, INC.}
Plating: Go₁ld₁₃o₅r₁S_Ro_ul_pd_per_Df_ri_.n_Sis_uh_{ite 400 Burnsville, MN 55337}
PCB Pad height: SameTeolreh: (ig95h2e)r2t2h9a-n82s0o0lder mask
www.ironwoodelectronics.com
Status: Released
Drawing: H. Hansen
File: SS-BGA104A-01 Dwg
Scale:
Rev: B
Date: 6/20/05
Modified: 1/3/07
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