SM-BGA-9025 Datasheet, PDF (3/4 Pages) Ironwood Electronics. – Low and stable contact resistance for reliable production yield

IRONWOOD PACKAGE CODE: BGA788C1
B
A
D
0.08 C
A
A1
D1
E
E1
C
e
14.500
b
0.15 M C A B
.05 M C
1. Dimensions are in millimeters.
2. Interpret dimensions and tolerances per ASME Y14.5M-1994.
3. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z.
4. Datum Z (seating plane) is defined by the spherical crowns of the solder balls.
5. Parallelism measurement shall exclude any effect of mark on top surface of package.
DIM
MIN
MAX
A
1.70
A1
0.15
b
0.25
0.35
D
15.90
16.10
E
15.90
16.10
D1
14.50 BSC
E1
14.50 BSC
e
0.50 BSC
Description: BGA
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SM-BGA-9025 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 16.52
STATUS: Released
DRAWN BY: M. Raske
FILE: SM-BGA-9025 Dwg
SHEET: 3 OF 4
SCALE: 4:1
DATE: 12/20/2012
REV. A