SM-BGA-9024 Datasheet, PDF (3/5 Pages) Ironwood Electronics. – Highly compliant to accommodate wide co-planarity variations

Compatible BGA device
D
Y
30.80 (x4)
26.80(x4)
A
X
E
1.16 REF
0.15 Z
b
0.08 Z
0.15 Z X Y
0.80 typ.
A1
0.50
1.30
1. Dimensions are in millimeters.
2. Interpret dimensions and tolerances per ASME Y14.5M-1994.
3. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z.
4. Datum Z (seating plane) is defined by the spherical crowns of the solder balls.
5. Parallelism measurement shall exclude any effect of mark on top surface of package.
29.60 (x4)
DIM
MIN
MAX
A
1.00
4.00
A1
0.5
0.6
b
0.45
0.55
D
31.00 BSC
E
31.00 BSC
e
0.80
38x38 Array
Description: Compatible BGA Device
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SM-BGA-9024 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: Material <not specified>
Finish:
Weight: 178.19
STATUS: Released
DRAWN BY: V. Panavala
FILE: SM-BGA-9024 Dwg
SHEET: 3 OF 5
SCALE: 1:1
DATE: 2/6/2013
REV. A