SM-BGA-9007 Datasheet, PDF (3/4 Pages) Ironwood Electronics. – Easily removalbe swivel socket lid

Compatible BGA IC
pin 1 marking
9.75
A
2X
0.15 C
TOP VIEW
B
6.00
102 X 0.40
Solder Balls
0.15 C M A B
0.08 C M
0.75
BOTTOM VIEW ^0.75
Pin 1
9.00
5.25
0.375
0.75
3.29
2.93
2.52
2.17
B
SIDE VIEW
C
0.43
0.28
1. Dimensions are in millimeters.
2. Interpret dimensions and tolerances per ASME Y14.5M-1994.
84X
0.10 C
C
DETAIL B
SCALE 10 : 1
3. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z.
4. Datum Z (seating plane) is defined by the spherical crowns of the solder balls.
5. Parallelism measurement shall exclude any effect of mark on top surface of package.
Description: IC package
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all
other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SM-BGA-9007 Drawing
©2015 Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 6.53
STATUS: Released
ENG: E. Smolentseva
FILE: SM-BGA-9007 Dwg
SHEET: 3 OF 4
DRAWN BY: E. Smolentseva
DATE: 2/10/2012
REV. B
SCALE: 5:1