SG-BGA-6363 Datasheet, PDF (3/3 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Compatible BGA Spec
X
D
Y
DETAIL
E
0.20
TOP VIEW
e
SIDE VIEW
3 _Øb
Ø0.25 Z X Y
Ø0.10
BOTTOM VIEW
A
A1
DETAIL
Z4
5
0.25 Z
0.2 Z
1. Dimensions are in millimeters.
2. ^{Interpret dimensions and tolerances per ASME}
Y14.5M-1994.
Dimension b is measured at the maximum
3 _{solder ball diameter, parallel to datum plane Z.}
Datum Z (seating plane) is defined by the
4 _{spherical crowns of the solder balls.}
Parallelism measurement shall exclude any
5 _{effect of mark on top surface of package.}
DIM MIN
MAX
A
3.36
A1
0.4
0.6
b
0.76
D
29.0 BSC
E
29.0 BSC
e
1.00 BSC
Array 28 x 28
SG-BGA-6363 Drawing
© 2012 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Scale: NA
Rev: A
Drawing: V. Panavala
Date: 8/29/2012
File: SG-BGA-6363 Dwg.mcd
Modified:
PAGE 3 of 3