SG-BGA-6212 Datasheet, PDF (3/3 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Compatible BGA Spec
X
D
Y
E
0.20
TOP VIEW
DETAIL
A
A1
DETAIL
Z4
SIDE VIEW
5
0.20 Z
0.12 Z
e
3
Øb
Ø0.25 Z X Y
Ø0.10
BOTTOM VIEW
1 ^{Dimensions are in millimeters.}
DIM
Interpret dimensions and tolerances per ASME A
2 _Y14.5M-1994.
A1
Dimension b is measured at the maximum
3 _{solder ball diameter, parallel to datum plane Z.}
b
Datum Z (seating plane) is defined by the
D
4 _{spherical crowns of the solder balls.}
E
Parallelism measurement shall exclude any
5 _{effect of mark on top surface of package.}
e
MIN
MAX
1.4
0.25
0.37
0.5
11.00 BSC
8.00 BSC
0.80 BSC
Array 12 x 8
SG-BGA-6212 Drawing
© 2006 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: J. Glab
File: SG-BGA-6212 Dwg.mcd
Scale: -
Rev: F
Date: 12/18/06
Modified: 7/7/09
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