SG-BGA-6107 Datasheet, PDF (3/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Compatible BGA Spec
X
D
Y
DETAIL
e
E
0.20
TOP VIEW
SIDE VIEW
3 _Øb
Ø0.25 Z X Y
Ø0.10
BOTTOM VIEW
A
A1
DETAIL
Z
4
5
0.20 Z
0.2 Z
1. Dimensions are in millimeters.
2. ^{Interpret dimensions and tolerances per ASME}
Y14.5M-1994.
Dimension b is measured at the maximum
3 _{solder ball diameter, parallel to datum plane Z.}
Datum Z (seating plane) is defined by the
4 _{spherical crowns of the solder balls.}
Parallelism measurement shall exclude any
5 _{effect of mark on top surface of package.}
DIM
MIN
MAX
A
2.85
A1
0.4
0.6
b
0.70
D
27.00 BSC
E
27.00 BSC
e
1.0 BSC
Array 26x26
SG-BGA-6107 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: H. Hansen
File: SG-BGA-6107 Dwg
Scale: -
Rev: D
Date: 4/9/04
Modified: 7/21/09, AE
PAGE 3 of 4