SG-BGA-6098 Datasheet, PDF (3/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Compatible BGA Spec
X
D
Y
DETAIL
e
E
3 _Øb
Ø0.15 Z X Y
0.30
TOP VIEW
A
A1
DETAIL
Z
4
SIDE VIEW
BOTTOM VIEW
5
0.35 Z
0.2 Z
1. Dimensions are in millimeters.
2. ^{Interpret dimensions and tolerances per ASME}
Y14.5M-1994.
Dimension b is measured at the maximum
3 _{solder ball diameter, parallel to datum plane Z.}
Datum Z (seating plane) is defined by the
4 _{spherical crowns of the solder balls.}
Parallelism measurement shall exclude any
5 _{effect of mark on top surface of package.}
DIM
MIN
MAX
A
2.46
A1
0.4
0.6
b
0.70
D
27.00 BSC
E
27.00 BSC
e
1.0 BSC
Array 25x25
SG-BGA-6098 Drawing
© 2003 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: H. Hansen
File: SG-BGA-6098 Dwg
Scale: -
Rev: C
Date: 12/29/03
Modified: 5/19/09
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