SBT-QFE-3006 Datasheet, PDF (3/4 Pages) Ironwood Electronics. – Low and stable contact resistance for reliable production yield

Ironwood Package Code: QFE80SC
D
A
e
b
E
E1
A1
D1
1. Dimensions are in millimeters.
2. Interpret dimensions and tolerances per ASME Y14.5M-1994.
3. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z.
4. Datum Z (seating plane) is defined by the spherical crowns of the solder balls.
5. Parallelism measurement shall exclude any effect of mark on top surface of package.
Description: Compatible QFP
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SBT-QFE-3006 Drawing
©2015 Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 8.93
STATUS: Released
ENG: M.A. Fedde
FILE: SBT-QFE-3006 Dwg
DIM Minimum Maximum
A
X.XX
1.60
A1
0.05
0.15
b
0.17
0.23
D
14.00 BSC
D1
12.00 BSC
E
14.00 BSC
E1
12.00 BSC
e
0.50 BSC
SHEET: 3 OF 4
DRAWN BY: M. Raske
DATE: 07/22/2015
REV. A
SCALE: 5:1