SBT-BGA-6527 Datasheet, PDF (3/4 Pages) Ironwood Electronics. – Low and stable contact resistance for reliable production yield

D
Y
X
e
E
Ironwood Package Code BGA774B
A
Z
A1
DETAIL A
SCALE 4 : 1
b
0.10 S Z
A
0.25 S Z X S Y S
1. Dimensions are in millimeters.
2. Interpret dimensions and tolerances per ASME Y14.5M-1994.
3. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z.
4. Datum Z (seating plane) is defined by the spherical crowns of the solder balls.
5. Parallelism measurement shall exclude any effect of mark on top surface of package.
DIM Minimum Maximum
A
2.308
2.808
A1
0.36
0.46
b
0.50
D
25.00 BSC
E
25.00 BSC
e
0.80 BSC
ARRAY
30x30
PIN COUNT
744
Description: Compatible BGA
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SBT-BGA-6527 Drawing
©2015 Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 51.18
STATUS: Released
ENG: M.A. Fedde
FILE: SBT-BGA-6527 Dwg
SHEET: 3 OF 4
DRAWN BY: M. Raske
DATE: 05/27/2015
REV. A
SCALE: 2:1