SBT-BGA-6511 Datasheet, PDF (3/4 Pages) Ironwood Electronics. – Excellent signal integrity at high frequencies

Ironwood Package code: BGA176L
D
0.10
e
E
b
0.05 Z X Y
0.05 Z
A
E
0.1 Z
1. Dimensions are in millimeters.
2. Interpret dimensions and tolerances per ASME Y14.5M-1994.
3. Dimension b is measured at the maximum solder ball diameter, parallel to
datum plane Z.
4. Datum Z (seating plane) is defined by the spherical crowns of the solder
balls.
5. Parallelism measurement shall exclude any effect of mark on top surface of
package.
DIM
Minimum
Maximum
A
1.07
A1
0.16
0.26
Z DETAIL E
SCALE 10 : 1
A1
0.08 Z
b
0.25
0.35
D
13.0 BSC
E
13.0 BSC
Description: BGA
e
0.8 BSC
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SBT-BGA-6511 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 15.00
STATUS: Released
ENG: S. Huang
FILE: SBT-BGA-6511
SHEET: 3 OF 4
DRAWN BY: D. Hauer
DATE: 4/4/13
REV. A
SCALE: 5:1