SBT-BGA-6030 Datasheet, PDF (3/4 Pages) Ironwood Electronics. – Automated probe manufacturing enables low cost and short lead time

XY
D
Orienation Mark
0.20 (X4)
Ironwood Package Code: BGA1738A
e
E
b
0.25 Z X Y
0.10 Z
0.25 Z
A
0.20 Z
Z
A1
1. Dimensions are in millimeters.
2. Interpret dimensions and tolerances per ASME Y14.5M-1994.
3. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z.
4. Datum Z (seating plane) is defined by the spherical crowns of the solder balls.
5. Parallelism measurement shall exclude any effect of mark on top surface of package.
DIM Minimum Maximum
A
2.85
3.25
A1
0.40
0.60
b
0.50
0.70
D
42.50 BSC
E
42.50 BSC
e
1.00 BSC
ARRAY
42 x 42
PIN COUNT
1738
Description: Compatible BGA
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SBT-BGA-6030 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 111.87
STATUS: Released
ENG: M.A. Fedde
FILE: SBT-BGA-6030 Dwg
SHEET: 3 OF 4
DRAWN BY: M. Raske
DATE: 04/01/2014
REV. B
SCALE: 2:1