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CG-BGA-4003 Datasheet, PDF (3/4 Pages) Ironwood Electronics. – Directly mounts to target PCB with hardware
Compatible BGA Spec
X
D
Y
E
DETAIL
A
A1
DETAIL
Z
4
5
0.20 Z
0.2 Z
TOP VIEW
0.20
e
3 Øb
Ø0.25 Z X Y
Ø0.10
BOTTOM VIEW
CG-BGA-4003 Drawing
© 2007 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
SIDE VIEW
1. Dimensions are in millimeters.
2. Interpret dimensions and tolerances per ASME
Y14.5M-1994.
Dimension b is measured at the maximum
3 solder ball diameter, parallel to datum plane Z.
Datum Z (seating plane) is defined by the
4 spherical crowns of the solder balls.
Parallelism measurement shall exclude any
5 effect of mark on top surface of package.
DIM
MIN
MAX
A
2.45
A1
0.4
0.6
b
0.70
D
23.00 BSC
E
23.00 BSC
e
1.0 BSC
Array 22x22
Status: Released
Drawing: J. Glab
File: CG-BGA-4003 Dwg
Scale: -
Rev: A
Date: 9/12/07
Modified:
PAGE 3 of 4