SM-BGA-9047 Datasheet, PDF (2/5 Pages) Ironwood Electronics. – Low and stable contact resistance for reliable production yield

1.25±0.125 (x4)
2.2625
1.25±0.125 (x4)
2.6375 *
A1 Orientation
23.725±0.050
19.20
6.7825±0.025
0.80 typ.
* Note: BGA pattern is not symmetrical
with respect to the mounting holes.
BGA array is shifted 0.375mm to the
right of center.
0.850±0.025
non plated alignment holes
9.3225±0.025
0.43 pad (x625)
0.80 typ.
19.20
23.725±0.050
1.70±0.10 (x4)
non plated mounting holes
26.225±0.125
SOCKET BASE OUTLINE
Description: Recommended PCB Layout
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance
±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
Target PCB Recommendations
Total thickness: 1.6mm min.
Plating: Gold or Solder finish
PCB Pad height: same or higher than solder mask
SM-BGA-9047 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material:
Finish:
Weight:
STATUS: Released
ENG: S. Faiz
FILE: SM-BGA-9047 Dwg
SHEET: 2 OF 5
DRAWN BY: M. Raske
DATE: 04/30/2014
REV. A
SCALE: 4:1