SM-BGA-9044 Datasheet, PDF (2/5 Pages) Ironwood Electronics. – Low and stable contact resistance for reliable production yield

A1 mark
3.0125*
7.20
0.40 typ.
2.5625
1.2825
3.80 (x2)
6.3625 (x4)
*Note: BGA pattern is not symmetrical with respect
to the mounting holes, it is offset 0.25mm
1.7100±0.1000 (x4)
non plated mounting holes
0.8500±0.0250 (x2)
non plated alignment holes
3.8225
7.60
0.40 typ.
0.2500 pad (x380)
3.3500*
3.8500
6.3625 (x4)
12.7250±0.0500
15.2250 socket size
17.7250 backing and insulating plate size
Description: Recommended PCB Layout
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SM-BGA-9044 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: Material <not specified>
Finish:
Weight: 7.03
STATUS: Released
ENG: E. Smolentseva
FILE: SM-BGA-9044 Dwg
Target PCB Recommendations
Total thickness: 1.6mm min.
Plating: Gold or Solder finish
PCB Pad height: same or higher than
solder mask
SHEET: 2 OF 5
DRAWN BY: M. Raske
DATE: 12-17-2013
REV. B
SCALE: 6:1