SM-BGA-9035 Datasheet, PDF (2/5 Pages) Ironwood Electronics. – Highly compliant to accommodate wide co-planarity variations

A1 corner
0.8 typ
0.430 (x264) pad
32.60
21.714 backing plate outline
20.600 socket outline
9.2375±0.025
8.4875±0.025
37.225
3.7825±0.025
*Note: BGA pattern is not symmetrical
with respect to the mounting holes.
It is shifted by 0.375mm to the center of right.
Maximum components height 4.7mm
Maximum components height 8.3mm
Maximum components height 3.3mm
6.3225±0.025
20.225
socket outline
6.80
8.8625±0.025 (x2)
6.35
8.50
6.80
Description: Recommended PCB Layout
13.60
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SM-BGA-9035 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 86.49
STATUS: Released
ENG: E. Smolentseva
FILE: SM-BGA-9035
Target PCB Recommendations
Total thickness: 1.6mm min.
Plating: Gold or Solder finish
PCB Pad height: Same or higher than solder mask
SHEET: 2 OF 5
DRAWN BY: E. Smolentseva
DATE: 4/4/13
REV. B
SCALE: 3.5:1