SM-BGA-9010 Datasheet, PDF (2/4 Pages) Ironwood Electronics. – Automated probe manufacturing enables low cost and short lead time

A1 Orientation
2.6375 Ref.
42.60
9.4125
2.2625 Ref.
Note: BGA pattern is not symmetrical
with respect to the mounting holes.
BGA array is shifted 0.375mm to the
right of center.
Keep out area
0.850±0.025
non plated alignment holes
49.225
9.60
6.7825±0.0250
9.3225±0.0250
0.80 Typ.
26.225±0.125
socket base
3mm max.
component height
1.25
1.25
0.43 (x 564)
6.50 (x6)
1.70±0.10 (x4)
6.35
non plated mounting holes
1.5mm max. component height
Latch Area
18.50
23.725±0.050
26.600±0.125 socket base
Description: Recommended PCB Layout
28.725±0.125 backing plate
Target PCB Recommendations
Total thickness: 1.6mm min.
Plating: Gold or Solder finish
PCB Pad height: same or higher than solder mask
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SM-BGA-9010 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material:
Finish: 138.86
Weight: Material <not specified>
STATUS: Released
DRAWN BY: V. Panavala
FILE: SM-BGA-9010
SHEET: 2 OF 4
SCALE: 2.5:1
DATE: 8/19/2012
REV. A