SG-MLF-7065 Datasheet, PDF (2/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

17.225±0.125 socket outline
5.7125*
0.250
*Note: ODFN pattern is not symmetrical with respect to the
mounting holes. It is offset 0.25mm to the right of center.
1.70±0.10 (x4)
NON-PLATED MOUNTING HOLE
0.850±0.025 (x2)
NON-PLATED ALIGNMEMT HOLE
6.3625
7.3625±0.025
2.2825
17.225±0.125
socket outline
7.3625±0.025
4.8225
DETAIL A
SCALE 15 : 1
3.80
1.90
0.60
0.25
A
1.00
2.00
2.10
9.950±0.125
14.725±0.050
19.500±0.125
Target PCB Recommendations
Description: Socket for 4x3mm 10 lead ODFN device
Primary dimension units are millimeters, Secondary dimension units are [inches].
Total thickness: 1.5mm min.
Plating: Gold or Solder finish
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SG-MLF-7065 Specification
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 5.24
STATUS: Released
DRAWN BY: D. Hauer
FILE: SG-MLF-7065 Dwg
SHEET: 2 OF 4
SCALE: 5:1
DATE: 5/1/2012
REV. A