SG-BGA-6403 Datasheet, PDF (2/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Recommended PCB Layout
Top View
Pin A1
12.025*
*Note: BGA pattern is not symmetrical
with respect to the mounting holes.
0.85±0.025 (x2)
12.400
32.225±0.125
Socket outline
9.783±0.025
12.3225±0.025
0.80 typ.
0.42 pad
24.80
29.7250±0.0500
Description: SG BGA socket for 27mm 0.8mm pitch 32x32 array BGA package
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SG-BGA-6403 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 75.93
STATUS: Released
ENG: E. Smolentseva
FILE: SG-BGA-6403 Dwg
1.7100±0.10 (x4)
Target PCB Recommendations
Total thickness: 1.6mm min.
Plating: Gold or Solder finish.
PCB Pad height: Same or higher
than solder mask.
SHEET: 2 OF 4
DRAWN BY: M. Raske
DATE: 4/16/2014
REV. A
SCALE: 3.5:1