SG-BGA-6366 Datasheet, PDF (2/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Recommended PCB Layout
Top View
1.250mm±0.125mm(x4)
Orientation Mark
1.250mm±0.125mm(x4)
2.3625mm(x4)
15.225mm±0.125mm(x4)
Socket size
8.00mm (x2)
5.08mm
6.40mm (x2)
3.5375mm*
* Note: BGA pattern is not symmetrical
with respect to the mounting holes.
0.375mm *
2.54mm
Ø 0.850mm±0.050mm(x2)
Non Plated Alignment Hole
Ø 0.40mm pad (x108)
Note: Full BGA pattern shown.
Please adjust pattern according
to individual requirements.
Target PCB Recommendations
Total thickness: 1.6mm min.
Plating: Gold or Solder finish
PCB Pad height: Same or higher than solder mask
0.80mm typ.
12.725mm(x4)
Ø 1.71mm±0.10mm (x4)
Mounting Hole
NOTE: Steel backing plate may be required based on end user's application
Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise.
SG-BGA-6366 Drawing
© 2012 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: S. Huang
File: SG-BGA-6366 Dwg.mcd
Scale: 5:1
Rev: A
Date: 1/4/13
Modified: 1/4/13
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