SG-BGA-6365 Datasheet, PDF (2/3 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Recommended PCB Layout
Top View
Note: Full BGA pattern shown.
Please adjust pattern according
to individual requirements.
5.74mm
2.36mm
23.225mm±0.125mm sqr.
Socket size
5.08mm
Orientation Mark
1mm typ.
*Note: BGA pattern is not symmetrical
with respect to the mounting holes. It is
offset 0.375mm to the right of center with
respect to the mounting holes.
Ø 4.78mm (x4)
backside mounting hardware
2.54mm
Ø 0.85mm±0.03mm x2
Alignment Hole
Ø 0 .5 m m P a d
1.2 5mm±0 .13m m(x4)
Target PCB Recommendations
Total thickness: 2.4mm min.
Plating: Gold or Solder finish
PCB Pad height: Same or higher than solder mask
20.725mm(x4)
1.2 5mm±0 .13m m(x4)
Ø 1.61mm±0.05mm x4
Mounting Hole
NOTE: Steel backing plate may be required based on end user's application
Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise.
SG-BGA-6365 Drawing
© 2012 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: M.A. Fedde
File: SG-BGA-6365 Dwg.mcd
Scale: -
Rev: A
Date: 8/3/12
Modified:
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