SG-BGA-6280 Datasheet, PDF (2/3 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Recommended PCB Layout
Top View
Orientation Mark
1.25mm±0.13mm(x4)
1.25mm±0.13mm(x4)
Socket
Body Size
3.8625mm
13mm
*Note: BGA pattern is not symmetrical
with respect to the mounting holes.
2.2375mm*
1mm typ.
2.54mm
Ø 0.85mm±0.025mm (x2)
Non plated alignment hole
Ø 0.51mm pad (x104)
5.08mm
Target PCB Recommendations
Total thickness: 1.6mm min.
Plating: Gold or Solder finish
PCB Pad height: Same or higher than solder mask
17mm
15.95mm
20.725mm(x4)
23.225mm±0.125mm (x4)
Ø 1.61mm±0.05mm (x4)
Non plated mounting hole
NOTE: Steel backing plate may be required based on end user's application
Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise.
SG-BGA-6280 Drawing
© 2008 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Scale: -
Rev: B
Drawing: Elena Smolentseva
Date: 10/22/08
File:SG-BGA-6280 Dwg.mcd
Modified: 11/3/2010
PAGE 2 of 3
Compatible BGA Spec
TOP VIEW