SG-BGA-6202 Datasheet, PDF (2/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Recommended PCB Layout
Top View
Orientation Mark
1.25mm±0.13mm(x4)
2.36mm
26.225mm±0.125mm(x4)
Socket size
5.08mm
1.25mm±0.13mm(x4)
2.74mm*
1mm typ.
*Note: BGA pattern is not symmetrical
with respect to the mounting holes.
2.54mm
Ø 0.85mm±0.025mm (x2)
Ø 0.51mm PAD
Note: Full BGA pattern shown.
Please adjust pattern according
to individual requirements.
19mm(x4)
23.725mm(x4)
28.725mm sq. backing plate
Ø 1.61mm±0.05mm (x4)
Target PCB Recommendations
Total thickness: 1.6mm min.
Plating: Gold or Solder finish
PCB Pad height: Same or higher than solder mask
NOTE: Steel backing plate may be required based on end user's application
Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise.
SG-BGA-6202 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: J. Glab
File: SG-BGA-6202 Dwg.mcd
Scale: 2:1
Rev: C
Date: 10/27/06
Modified: 7/8/09, AE
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