SG-BGA-6190 Datasheet, PDF (2/3 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Recommended PCB Layout
Top View
2.74mm
2.36mm
23.225mm±0.125mm sqr.
Socket size
Orientation Mark
0.8mm typ.
*Note: BGA pattern is not symmetrical
with respect to the mounting holes.
Note: Full BGA pattern shown.
Please adjust pattern according
to individual requirements.
2.54mm
Ø 0.85mm±0.03mm
Alignment Hole
Ø 0.43mm PAD
5.08mm
1.25mm±0.13mm(x4)
20.725mm(x4)
Ø 1.61mm±0.05mm
Mounting Hole
1.25mm±0.13mm(x4)
Target PCB Recommendations
Total thickness: 2.4mm min.
Plating: Gold or Solder finish
PCB Pad height: Same or higher than solder mask
NOTE: Steel backing plate may be required based on end user's application
Recommended PCB Layout Tolerances: ±0.025mm [±0.001"] unless stated otherwise.
SG-BGA-6190 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Dr. Suite 400 Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: M.A. Fedde
File: SG-BGA-6190 Dwg.mcd
Scale: -
Rev: B
Date: 9/26/06
Modified: 7/20/09, AE
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