SG-BGA-6136 Datasheet, PDF (2/3 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Recommended PCB Layout
Top View
Orientation Mark
Socket
Body Size
1.25mm±0.13mm(x4)
1.25mm±0.13mm(x4)
2.26mm
Note: Full BGA pattern shown.
Please adjust pattern according
to individual requirements.
5.08mm
*Note: BGA pattern is not symmetrical
with respect to the mounting holes.
2.64mm*
0.8mm typ.
2.54mm
Ø 0.85mm±0.03mm (x2)
Non plated alignment hole
Ø 0.43mm pad (x400)
19.725mm (x4)
22.225mm±0.125mm (x4)
Ø 1.61mm±0.05mm (x4)
Non plated mounting hole
Target PCB Recommendations
Total thickness: 1.6mm min.
Plating: Gold or Solder finish
PCB Pad height: Same or higher than solder mask
NOTE: Steel backing plate may be required based on end user's application
Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise.
SG-BGA-6136 Drawing
Status: Released
Scale: 3:1
Rev: C
© 2009 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Drawing: B. Roux
File: SG-BGA-6136 Dwg.mcd
Date: 11/23/04
Modified: 7/6/09, AE
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