SG-BGA-6115 Datasheet, PDF (2/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Recommended PCB Layout
Top View
Orientation Mark
1.25mm±0.13mm(x4)
2.33mm
1.25mm±0.13mm(x4)
2.71mm*
1.27mm typ.
42.725mm±0.125mm(x4)
Socket size
5.08mm
2.5mm±0.13mm
*Note: BGA pattern is not symmetrical
with respect to the mounting holes. It is
offset by 0.375mm to the right of center
with respec to the mounting holes.
2.54mm
Ø 0.85mm±0.025mm(x2)
Non plated alignment hole
Ø 0.635mmxPAD
Target PCB Recommendations
Total thickness: 2.4mm min.
Plating: Gold or Solder finish
PCB Pad height: Same or higher than solder mask
2.5mm±0.13mm
20.113mm(x8)
45.225mm (x4)
Backing plate size
Ø 1.61mm±0.05mm(x8)
Non plated mounting hole
NOTE: Steel backing plate may be required based on end user's application
Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise.
SG-BGA-6115 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: H. Hansen
File: SG-BGA-6115 Dwg
Scale: 2:1
Rev: C
Date: 3/19/04
Modified: 11/4/09
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