SG-BGA-6009 Datasheet, PDF (2/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Recommended PCB Layout
Top View
Orientation Mark
2.5mm
1.25mm±0.13mm(x4)
Socket
Body Size
2.363mm
2.5mm
1.25mm±0.13mm(x4)
2.738mm*
32.225mm±0.125mm (x4)
*Note: BGA pattern is not symmetrical
with respect to the mounting holes.
1mm typ.
2.54mm
Ø 0.85mm±0.025mm (x2)
Nonplated Alignment Hole
Ø 0.51mmPAD
5.08mm
Target PCB Recommendations
Total thickness: 1.6mm min.
Plating: Gold or Solder finish
PCB Pad height: Same or higher than solder mask
NOTE: Steel backing plate may be required based on end user's application
29.725mm(x4)
34.725mm (x4)
Backing Plate Size
Ø 1.61mm±0.05mm (x4)
Nonplated Mounting Hole
Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise.
SG-BGA-6009 Drawing
© 2001 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Scale: 3:1
Rev: H
Drawing: Meghann Fedde
Date: 8/17/01
File: SG-BGA-6009 Dwg
Modified: 5/19/09
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