CG-QFN-7002 Datasheet, PDF (2/3 Pages) Ironwood Electronics. – Minimum real estate required

Recommended PCB Layout
Top View
Orientation Mark
1.25mm±0.13mm (x4)
1.250mm±0.125mm (x4)
C*
e typ.
*Note: MLF pattern is not symmetrical with
respect to the mounting holes. It is offset
0.25mm to the right of center.
B
2.54mm
15.225mm±0.125mm sqr.
Socket size
Z2 max
A2 max
5.08mm
A1 max
Z1 max
12.725mm±0.125mm (x4)
Ø 0.850mm+- ^{00..002255mmmm} (x2)
Non plated alignment hole
Y x X mm pad (x N)
Ø 1.610mm+- ^{00..005500mmmm} (x4)
Non plated mounting hole
Target PCB Recommendations
Total thickness: 1.6mm min.
Plating: Gold or Solder finish
PCB Pad height: Same or higher than solder mask
**** To effectively conduct heat away from the package a
thermal pad is recommended with vias spaced
1.0 to 1.2 mm pitch and a diameter of 0.3 to 0.33 mm.
Ideally 1 via for every 3 leads has been shown to work well.
All dimensions are in mm unless stated otherwise
Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise.
CG-QFN-7002 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: M.A. Fedde
File: CG-QFN-7002 Dwg.mcd
Scale: 3:1
Rev:B
Date: 11/2/09
Modified: 05/07/14, DH
Recommended PCB Layout
Tolerances: ±0.025mm [±0.001”]
unless stated otherwise.
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