CG-QFN-7001 Datasheet, PDF (2/3 Pages) Ironwood Electronics. – Easily removable clamshell socket lid

Recommended PCB Layout
Top View
Orientation Mark
1.25mm±0.13mm (x4)
1.25mm±0.125mm (x4)
C*
e typ.
*Note: MLF pattern is not symmetrical with
respect to the mounting holes. It is offset
0.25mm to the right of center.
B
2.54mm
15.225mm±0.125mm sqr.
Socket size
Z2 max
A2 max
5.08mm
A1 max
Z1 max
12.725mm±0.125mm (x4)
Ø 0.85mm+- ^{00..002255mmmm} (x2)
Non plated alignment hole
Y x X mm pad (x N)
Ø 1.61mm+- ^00..0055mmmm (x4)
Non plated mounting hole
**** To effectively conduct heat away from the package a
thermal pad is recommended with vias spaced
1.0 to 1.2 mm pitch and a diameter of 0.3 to 0.33 mm.
Ideally 1 via for every 3 leads has been shown to work well.
Package Code C
MLF68A
2.47
B Z1max A1max Z2max A2 min e
1.18 10.36 8.28 10.36 8.28 0.5
Xmax Yref N Thermal Pad Recommendations
0.28 0.94 68
8.08 x 8.08
Target PCB Recommendations
Total thickness: 1.6mm min.
Plating: Gold or Solder finish
PCB Pad height: Same or higher than solder mask
CG-QFN-7001 Drawing
© 2010 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: Vinayak R
File: CG-QFN-7001 Dwg
Scale: 3:1
Rev: B
Date: 3/1/10
Modified: 05/07/14, DH
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